UV Curing Systems for 3D Substrates
Uniform curing of three-dimensional product requires a departure from conventional half-ellipse systems designed for two-dimensional substrates, according to the manufacturer. Half-ellipse designs offer a depth of curing field of less than a 1-in. This means that 3D applications that require a curing field of 3-in. or more require numerous maximum-powered half-ellipse systems to uniformly cure the product.
However, this manufacturer's systems incorporate reflector shapes that are said to uniformly and economically cure 3D product by increasing the amount of focused curing energy and its depth of field to cure on multiple planes. By effectively focusing UV light in a tighter vertical concentration below the lamp and within the curing zone, they can provide optimal conditions for efficient 3D curing.
UV Process Supply, 1229 W. Cortland St., Chicago, IL 60614. Tel: 773-248-0099. Fax: 773-880-6647.