LATEST HEADLINES

• AM Solutions At The Formnext Exhibition, November 16 – 19, 2021, In Frankfurt: Innovative New Products Are Setting New Standards For Post Processing And Surface Refinement

  10/20/2021

  At this year’s formnext in Frankfurt AM Solutions – 3D post processing technology is presenting not one but three trend setting machines. The new S1 Wet was specifically developed for the removal of residual powder and the surface homogenization and smoothing of metallic 3D components.

• ITW Performance Polymers Launches Superior Wear-Resistant Coating, Devcon® Wear Guard™ 300RTC, A Highly Durable Compound For Elevated Temperature Applications

  10/20/2021

  ITW Performance Polymers has launched its next generation wear resistance compound, Devcon Wear Guard 300RTC designed to protect equipment in elevated temperature wet and dry environments.

• T-fal Launches New Unlimited Cookware Line

  10/20/2021

  For more than 60 years, T-fal has offered innovative cookware solutions to improve the everyday lives of consumers while in the kitchen.

• ACM Research Secures Order For ECP Demo Tool From Major IC Manufacturer

  10/18/2021

  ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced the receipt of an evaluation tool order for its Ultra ECP map copper plating tool from a major IC manufacturer. The order specifies a delivery in early 2022 and is subject to technical qualification and other commercial terms.

• Forge Nano Sells Prometheus™ Powder ALD Equipment To Mitsui Kinzoku, Japan

  10/14/2021

  Forge Nano, a Denver-based advanced materials equipment company, has sold Mitsui Mining & Smelting Co., Ltd. ("Mitsui Kinzoku") one of their flagship Prometheus™ powder ALD (PALD) systems.