Lead-Free Solder Finishing Product Introduced

Pforzheim, Germany -- AMI DODUCO offers the printed circuit board (PCB) industry a new flux material for hot-air levelling using lead-free solders. Hot-air levelling of tin/lead solder is the traditional surface finish for PCBs, but effective July 1, 2006, the European Union's Restriction of Hazardous Substances (RoHS) Directive will prohibit the use of lead in electrical and electronic appliances throughout the European Union. Solders containing lead must be replaced by lead-free alternatives such as tin/copper/nickel alloys. These solders, however, require a higher working temperature than conventional tin/lead materials.

Lead-free DOFLUX meets the need for hot-air levelling fluxes that can activate the new solder coatings at these higher temperatures. The new flux material is also very sparing in use and has good wetting properties.

DOFLUX is the latest in an expanding line of AMI DODUCO products for RoHS-compliant, lead-free surface finishing. This product family also includes the DODUCHEM chemical nickel/gold process for circuit boards and the DODUBRONCE AF white bronze bath for technical and decorative applications.

SOURCE: AMI DODUCO