Polese Acquires Electroless Gold Plating Business from Engelhard

The Polese Co. (San Diego, CA), a wholly owned subsidiary of SEMX Corp. (Armonk, NY), has acquired Engelhard Corporation's electroless gold plating business. The technology, patent rights and assets were acquired for cash.

Engelhard's electroless gold plating business serves the North American semiconductor packaging and printed circuit board markets. With this acquisition, Polese is able to enter the electroless gold plating market without starting from scratch. The company will also gain access to Engelhard's electroless gold plating technology for use in its own microelectronic applications, which include heat dissipation materials for the wireless and Internet markets.

Electroless gold plating provides a very high resistance to high-temperatures and corrosion, and allows exceptional circuit density, making it an ideal solution for everything from printed circuit board components to aircraft engine shrouds.

Polese is the creator of a high-volume, low-cost method of producing thermally enhanced flanges for power RF transistor packages that produces CuW composite. Shortly after developing this process, the company was acquired by SEMX.