Rotary Flow-Through Plating

Griego Electrochemical Technologies plater makes use of the company's Rotary Flow-Thru (RFT) plating technology. The single-station, automated machine is designed for bulk-process electroplating on surface mount electronic components. This compact machine — 1m × 2m footprint — features 100% cathode efficiency and can plate SMT chip capacitors and resistors to a thickness uniformity of CV 8-15%. It offers the ability to microencapsulate microcomponents as small as 25 µm in size without agglomeration or bridging.

The unit is also environmentally friendly. A catch basin rotates and changes position over a return drain and then goes on to the next process without drag-out. The manufacturer says that the system's closed path circulation and enclosed-tank design offers less exposure to corrosives, more recovered chemicals, less water usage, and greater plating uniformity. It uses all standard plating baths with either soluble or insoluble anodes. The manufacturer also states that the system's plating speed is five times faster than that of horizontal barrel plating.

<%=company%>, 4901-F Pan American Place NE, Albuquerque, NM 87109-4370. Tel: 502-342-1915. Fax: 502-342-1916.