Patented by MSA GmbH Electroplating Equipment (Königsbach, Germany), the system also offers reduced precious metal consumption, uniform distribution, component-to-component reliability, stripe placement accuracy of ± 0.004-in. (0.1mm), stripe-on-stripe or multiple-stripe capability, and minimal material stress.
The system's cell allows plating of stripes on flat strip, stamped semiconductor stock, or formed connectors. In addition, multiple cells can apply multiple stripes simultaneously to both sides or to either side of the product being processed.
<%=company%>, 40 Minnesota Ave., Warwick, RI 02888. Tel: 401-732-6677. Fax: 401-732-4466.