Semitool Goes Two for Two in Copper ECD Marathon

Order Extends Semitool's Leadership In Copper Deposition Market

Semitool Inc. announces it has received an order for multiple LT210c ECD tools from one of North America's leading semiconductor manufacturers. The tools will be used to apply copper interconnects in high-volume production of semiconductor devices and are expected to begin shipping in the company's second fiscal quarter.

"This win is significant for a number of reasons. Semitool has now gone head-to-head in marathon testing against both of its larger competitors and won. This further confirms the strength of Semitool's product and our belief that the industry is accelerating its adoption of copper," said Ray Thompson, chairman of Semitool.

Semitool's LT210c ECD system is designed with open architecture and advanced software control to facilitate integration into chip production lines with copper interconnects. The LT210c product also includes integrated wafer backside, bevel, and edge cleaning capabilities for removal of copper contamination. These capabilities, combined with high productivity and precise, repeatable deposition of copper films, provide a cost-effective solution for semiconductor manufacturers.

The semiconductor industry's transition to chips with copper interconnects is driven by the metal's potential to enhance performance while reducing power consumption and manufacturing cost. These are important factors in advancing the state-of-the-art in wireless communications and computing products.