SEZ Doubles Wafer Processing Capabilities With New Dual Chamber Spin-Processing System

The SEZ Group has introduced a new spin-processing system designed to meet next-generation requirements for high throughput cleaning and film removal applications for semiconductor wafer processing. Called the Spin-Processor 223, the system utilizes dual processing chambers and a small footprint design. Shipment of the product began this quarter.

The Spin-Processor 223 can process 80 or more wafers per hour and use up to three chemistries, effectively doubling previous spin-processing capabilities and matching the throughput of copper deposition tools. Additionally, the 223 uses 20 percent less fab floor space than two single chamber spin-processors and costs nearly 30 percent less.

"The Spin-Processor 223 offers the processing capabilities of earlier cleaning technologies while doubling overall system functionality," explained Michael Kucher, senior vice president for SEZ AG. "Cutting-edge fabs must meet new demands for film removal, copper decontamination and photolithography depth of focus enhancement. Our 223 meets the throughput demands and incorporates the technologies required for future semiconductor wafer processing."

The 223 platform works with SEZ's current applications including high-volume semiconductor production operations. This includes backside, bevel/edge and frontside exclusion zone copper decontamination, pre-clean for advanced lithography applications and frontside film removal applications.

About SEZ
The SEZ Group is a leading supplier of spin-processing equipment to the global semiconductor manufacturing industry. The company's breakthrough proprietary Spin-Processor technology forms the basis of a broad portfolio of backside and frontside wafer surface conditioning products for semiconductor chipmakers worldwide. SEZ maintains development, manufacturing, sales, marketing and service operations in Europe, Asia and North America. SEZ can be found on the web at www.sez.com.