SUR/FIN 2000: M.E. Baker enters into alliance with Ludy GmbH
Ludy was started in 1990 and shipped its first redeveloped plant in 1992. In addition to its plating tanks, rectifiers (more on them later), air and water waste treatment systems, and other plant components, Ludy also keeps programming engineers on their software team to help keep the lines—especially their control systems—moving without interruption. In addition, the company offers PLC systems, called SIMATIC S5/S7, and personal computers to accomplish operation, data processing and process visualization, creating a fully automated line. Their Multiprogramm PLC system is recommended for electroplating operations because it can adapt to any changes in the plating process.
The joining of forces, if you will, between Ludy and M.E. Baker is significant for two reasons: first, it helps make reverse pulse plating more readily available in North America and it combines the strengths of both companies to optimize plating lines to their fullest potential.
Ludy's reverse pulse plating capabilities offer robotic material handling capabilities for printed circuit board plating. Since September 1999, the company has sold four automatic reverse pulse plating lines, totaling US$4 million, to two of the world's largest PCB manufacturers. Currently, they've got six production lines operating in Europe and just sold one line to a U.S.-based manufacturer using copper-tin. However, nickel, palladium and silver plating operations are also possible.
Pulse plating deposits metal on a substrate through interrupted—or pulsed—direct current. This creates a fine-grain deposit by allowing a higher number of grains to be deposited on the surface of the substrate. Further, this is especially beneficial to the microelectronics marketplace because circuit traces can now be placed closer together without shorting. The power supplies that allow this pulsing action to happen are often combined systems of perhaps DC rectifiers and switching circuits or are reverse pulse rectifiers themselves. Ludy's reverse pulse rectifiers are specially designed for this application and are capable of increasing the capacity by reducing exposure time. A specially designed bus system manages the data transfer, storage and monitoring of the diagnosis data (i.e. tank status indication), according to the company, and the Power Duoflex RPP cable system, specially designed for this application, offers exceptional connection of the tank and the rectifier.
Reverse Pulse Plating creates a fine-grain deposit.
M.E. Baker's extensive line of engineered systems for the electronic and plating industries complement Ludy's reverse pulse plating technology. For example, custom fabricated tanks are available through the company's alliance with Wegener GmbH and complete tank lines and consoles can also be customized to individual specifications. M.E. Baker's RIX, RIX-Jr. and LES waste treatment systems help take care of the waste generated by the reverse pulse plating process; the company's waste treatment systems are available in ion exchange, reverse osmosis, and membrane technologies. Finally, to control the whole process, the Multi-Axis Motion Control Systems 1000 (or Maxim CS-1000) uses programmable logic control to direct a single hoist. Designed around an Allen Bradley SLC Series PLC, the Maxim CS-1000 can store more than 200 programs with up to 250 program steps. The display indicates hoist position, speeds, etc.
At SUR/FIN, M.E. Baker promoted its new alliance with Ludy and the benefits of using reverse pulse plating for electronic applications.
For more information, in North America, contact M.E. Baker Co., 25 Wheeler St., Cambridge, MA 02138. Phone +1 (617) 547-5460; Fax +1 (617) 354-7396. In Europe, contact Ludy GmbH Systemtechnik, Grossgeschaidt Nr. 295, D-90562 Heroldsberg. Phone (+49) 9126/2565-0; Fax (+49) 9126/2565-50.
By Marie Pompili with information provided by M.E. Baker and Ludy